Offered technologies

Check out the technology options within our offer to verify that we will be able to complete your order

Laminate FR4

Universal application.

Low price and high availability.

Typical parameters: TG 135 ° C, CTI: PLC3, UL94 V-0, dielectric constant:> 4.0.
Also available: TG150, TG180.

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Laminate ALU

LED lighting and high power supply systems.

High thermal conductivity.

Aluminium layer as a radiator.

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Microwave laminate ROGERS

High frequency systems.

Temperature and frequency-stable dielectric parameters.

Low loss and dielectric constant.

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Technological parameters

  • NUMBER OF COPPER LAYERS:

    minimum / maximum

    0 (laminate without copper) / 8

  • BASE LAMINATE THICKNESS [mm]

    1-layer PCBs and 2-layer PCBs:

    minimum / maximum

    0.20 / 3.20

    available

    0.20 0.36 0,51 0,60 0.71 0,80 1.00 1.20 1.55 2.00 2.40 3.20

    Multilayer PCBs:

    minimum / maximum

    0.45 / 3.20

    thickness of dielectric layer

    from 0.1 (prepregs and cores)

  • END COPPER THICKNESS [µm]

    outer layers

    0 18 35 70 105 140 170 210 240

    inner layers

    18 35 70 105 140 170 210

  • FINAL DIAMETER OF PLATED-THROUGH HOLES [mm]

    minimum

    0.15

    maximum

    without limits

  • FINAL DIAMETER OF NON-PLATED HOLES [mm]

    minimum

    0.25

    maximum

    without limits

  • MIN. TRACK WIDTH [MILS]:

    Cu thickness 12 µm (base)

    3

    Cu thickness 18 µm (base)

    4

  • MIN. DISTANCE BETWEEN COPPER ELEMENTS [mils]

    Cu thickness 12 µm (base)

    3

    Cu thickness 18 µm (base)

    4

  • MIN. ANNULAR RING ON THE OUTER LAYERS [mils]

    minimum

    4

    typical

    5

  • MIN. ANNULAR RING ON THE INNER LAYERS [mils]

    4-layer PCBs:

    minimum

    4

    typical

    5

    6-layer PCBs:

    minimum

    5

    typical

    6

    8-layer PCBs:

    minimum

    5

    typical

    7

  • SURFACE FINISHING

    chemical goldening (ENIG) lead-free HAL

  • MECHANICAL TREATMENT

    routing scoring Z-routing chamfering plated edges

  • VIAS

    plated-through holes (PTH) non-plated holes (NPTH) buried vias blind vias plugged vias, Type IV IPC 4761

  • ELECTRICAL TEST

    fingertest

  • IPC class

    class II class III

  • NON-STANDARD MASKS

    peelable mask

  • UL FLAMMABILITY CERTIFICATE

    UL94-V0 class

  • SOLDERMASK (COLOR)

  • SILKSCREEN (COLOR)

  • MARKINGS

    Date code TS PCB logo PCB numeration

  • ADDITIONAL OPTIONS

    cross-section report quality report quantity tolerance +/-0% panels without X-outs providing panel files for approval paste files

Questions about products?

Download the file with full specifications, and if necessary, write to us – we will be happy to help you!

DOWNLOAD SPECIFICATION FILE CONTACT US