TSprint
The TSprint is a technologically advanced prototype series of up to 20 dm², realized in very short deadlines. The TSprint offering includes a wide range of laminates, copper thicknesses, types of solder masks and diverse mechanical treatments. This is an ideal way to quickly verify the correctness of even a very complex design.
ORDER / INQURYLead time
The business day on which the order is placed is included in the lead time if complete files and documentation are received by 9 am.
single- and double-sided boards:
multilayer boards:
| 1/2 layers | |
|---|---|
| number of days | express surcharge |
| 2 | 70 % |
| 3 | 50 % |
| 4 and more | 0 % |
| 4 layers | |
|---|---|
| number of days | express surcharge |
| 2 | 70 % |
| 3 | 50 % |
| 4 | 30 % |
| 5 and more | 0 % |
| 6/8 layers | |
| number of days | express surcharge |
| 3 | 70 % |
| 4 | 50 % |
| 5 | 30 % |
| 6 and more | 0 % |
Technological parameters
Specification
-
ORDER SIZE
up to 20 dm² -
BASE MATERIAL
FR4 -
BASE MATERIAL TYPE
TG135 TG150 TG180 -
BASE LAMINATE THICKNESS [mm]
0,51 0,60 0.71 0,80 0.90 1.00 1.20 1.40 1.55 2.00 -
NUMBER OF COPPER LAYERS:
0 1 2 4 6 8 -
END COPPER THICKNESS [µm]
outer layers
35 70 105inner layers
18 35 70 105 -
SOLDERMASK (COLOR)
-
SILKSCREEN (COLOR)
-
SURFACE FINISHING
chemical goldening (ENIG) lead-free HAL -
VIAS
plated-through holes (PTH) non-plated holes (NPTH) blind vias buried vias plugged vias, Type IV IPC 4761 -
ELECTRICAL TEST
fingertest -
IPC class
class II class III -
MECHANICAL TREATMENT
routing scoring Z-routing chamfering plated edges -
MARKINGS
Date code PCB numeration TS PCB logo UL94-V0 class -
ADDITIONAL OPTIONS
providing panel files for approval panels without X-outs paste files quality report quantity tolerance +/-0%
Questions about the product?
Download the file with full specifications, and if necessary, write to us – we will be happy to help you!