Benachrichtigungen:
Erklärungen:

Datenschutzpolitik

Agreements:

Declarations and certifications:
ISO 9001:2015 ISO 14001:2015 Certificate
Declaration of Conformity – RoHS, WEE, ELV, REACH
UL Certificate

Technische Spezifikation von Basismaterialien:
FR4 – ISOLA DE104
FR4 – ISOLA IS400 (TG 150º C)
FR4 – ISOLA IS400 (TG 150º C) - Dielectric Constant (DK) / Dissipation Factor (DF)
FR4 – ISOLA IS410 (TG 180º C)
FR4 – NAN YA FR-4-86
FR4 – NAN YA FR-4-86PY (CTI >600 V)
FR4 – NAN YA NP 140 TL (cores) + NP 140 B (prepregs)
FR4 – ILM U1 (multilayer PCBs)
FR4 – ILM R1 (1-layer and 2-layer PCBs)
Mikrowellen – Rogers RO3000
Mikrowellen – Rogers RO4000
Mikrowellen – Rogers RT/duroid®5870 /5880
MCPCB (ALU) – Polytherm-H TC-Lam 1.8-2.0

Lötstoplack- und Positionsdruck-Spezifikation:
Lötstoplack (standard) – Peters Elpemer 2467 ( curtain coating: green, semi mat)
Lötstoplack (photoimageable) und Positionsdruck – Peters SD 24XX
Lötstoplack (photoimageable) white – Taiyo PSR-4000 LEW-1
Peelable Lötstoplack – Peters SD 2955

Standardmäßiger Lagenaufbau von 4- , 6- und 8-Lagen Leiterplatten:

4-Lagen Leiterplatten:
4 ML PCB - Basislaminatdicke 0.55 (tol. +/- 10%)
4 ML PCB - Basislaminatdicke 0.80 mm(tol. +/- 10%)
[Prototypen TSka] 4 ML PCB - Basislaminatdicke 1.00 mm (tol. +/- 10%)
[Prototypen TSka] 4 ML PCB - Basislaminatdicke 1.55 mm (tol. +/- 10%)
4 ML PCB - Basislaminatdicke 2.00 mm (tol. +/- 10%)
4 ML PCB - Basislaminatdicke 2.40 mm (tol. +/- 10%)

6-Lagen Leiterplatten:
 6 ML PCB - Basislaminatdicke 1.00 mm (tol. +/- 10%)
 6 ML PCB - Basislaminatdicke 1.55 mm (tol. +/- 10%)
 6 ML PCB - Basislaminatdicke 2.00 mm (tol. +/- 10%)
 6 ML PCB - Basislaminatdicke 2.40 mm (tol. +/- 10%)

8-Lagen Leiterplatten:
8 ML PCB - Basislaminatdicke 1.55 mm (tol. +/- 10%)

Other documents:
Technological sheet
Manual: exporting Gerber files from the Eagle CAD software (version 9.2 and higher)
Manual: exporting Gerber files from the Eagle CAD software (up to version 9.1)
EAGLE configuration file (up to version 9.1)